300mm Processing Platform
Research Team


300mm Processing Platform Research TeamAbout

Open innovation for semiconductor manufacturing processes dealing with 300 mm silicon wafers

We work on open innovation for semiconductors. We engage in AIST’s advanced semiconductor projects as well as the fabrication services for the requests from organizations outside AIST. Our facility is operated under the clean conditions and metal contamination controls, which are equivalent to those of a mass-production semiconductor factory using 300 mm silicon wafers. CMOS devices, silicon photonics devices, and Cu-wiring structures are fabricated on our process platform.

産総研スーパークリーンルーム(SCR) (aist.go.jp) 

300mm Processing Platform Research TeamKeywords

300 mm silicon wafer

A silicon substrate with the diameter of 300 mm (the mainstream in semiconductor mass production)

Metal contamination

Contamination/adhesion of undesirable metal in/on wafers during semiconductor processes

300mm Processing Platform Research TeamFacility

Super Clean Room(SCR)

Extarnal website:産総研スーパークリーンルーム(SCR) (aist.go.jp) 

ArF immersion lithography equipment
Scene inside SCR
300 mm silicon wafers with various patterns after semiconductor processes

300mm Processing Platform Research TeamTeam Members

OTA Hiroyuki
TeamLeader
MORITA Yukinori
Web site
KOSHINO Keiji
Technical Senior Officer
ETOU Kimitoshi
Chief Senior Engineer
ISHITSUKA Eiichi
Senior Engineer
UENISHI Hiroshi
Senior Engineer
SASAKI Tomio
Senior Engineer
TAKEZAWA Yasunari
Senior Engineer
MATSUMARO Kazuyuki
Senior Engineer
MIYAKI Tomonori
Senior Engineer
ISHIKAWA Tomohiro
Invited Senior Researcher
UEDA Tetsuya
Invited Senior Researcher
YAGISHITA Atsushi
Invited Senior Researcher
IKEHARA Tsuyoshi
Adjunct
KAMEI Toshihiro
Adjunct

Research Team

National Institute of Advanced Industrial Science and Technology(AIST)
Semiconductor Frontier Research Center

16-1 Onogawa, Tsukuba, Ibaraki 305-8569, Japan  [Access]
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