Research Team

We are developing fundamental technologies related to materials, devices and fabrication processes used in semiconductor integrated circuits. From the creation of basic core technologies to the device demonstrations using state-of-the-art 300 mm equipment are consistently promoted.

We contribute to the establishment of innovative technologies in the semiconductor industry, where CMOS manufacturing processes are evolving into greater complexity.

We provide R&D and fabrication services of semiconductors using 300mm silicon wafers at Super Clean Room (SCR) located in AIST Tsukuba West. In our leading-edge semiconductor R&D, the preparation of the open pilot line with the latest semiconductor process equipment in SCR is now ongoing.

As a cutting-edge CMOS technology, we are actively advancing R&D with a focus on CMOS transistors, materials, processes, simulations, and TCAD for the 2 nm generation and beyond.

We have been studying the fundamental technologies for quantum computing, and the integrated device technologies for ultra-low power and high-speed device operation.

We are promoting the miniaturization, lower power consumption, and higher performance of electronics systems by using 3DIC technologies including flip-chip bonding, direct bonding, through-silicon via(TSV) without relying on process miniaturization.

In the cyber-physical system that society is rapidly becoming accustomed to, we aim to research and develop cutting-edge integrated circuit and system technology that will dramatically improve the energy efficiency of information processing, as well as to develop an integrated circuit design and development environment.