Quantum Device Research Team

Industrialization of quantum technology requires high integration of superconducting quantum chips and silicon photonics, and also the development of cryo-CMOS and superconducting digital circuits as control circuits. Achieve high yield and throughput development of semiconductor and superconductor circuit fabrication technology.

Supporting the practical application of quantum computers and the development of large-scale quantum computers by enhancing superconductor and semiconductor quantum device fabrication capabilities of Qufab and COLOMODE.

Development of technology for high-density mounting of wires for highly integrated quantum chips by applying precision processing technology.

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The Superconducting Quantum Circuit Fabrication Facility


We manage the The Superconducting Quantum Circuit Fabrication Facility (Qufab). This facility operates a 4-inch device prototyping line and provides process utilization and prototyping services. Qufab is capable of handling superconducting qubits and circuits, superconducting digital-analog integrated circuits, and superconducting 3D implementations.

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Staff Members

photo	position & name	field of expertise	and other info
	Team Leader, Wataru MIZUBAYASHI
	Research Manager, Hirotake YAMAMORI
	Senior Researcher, Iku HIRANO
	Senior Researcher, Nobuyuki ZEN	Superconductivity arising in a phonon-engineered metallic film ; Superconducting particle detectors
	Senior Researcher, Manabu TSUJIMOTO	Development of superconducting quantum bit devices
	Researcher, Yuichi FUJITA	Research and development of technologies for large-scale integrated circuits of superconducting quantum bit
	Researcher, Yoshiro URADE	Superconducting quantum circuits towards fault-tolerant quantum computers
	Researcher, Fumihiro CHINA	Research on superconducting logic circuits and superconducting device fabrication
	Concurrent post, Go FUJII
	Concurrent post, Katsuya KIKUCHI	Research and development of three-dimensional integrated circuit technology
	Concurrent post, Masahisa FUJINO	W2W/C2W Hybrid bonding ; CMP for hybrid bonding surface ; Structure analysis for interface of fusion bonding / surface activated bonding ; Superconducting metal bonding ; 3D integration for quantum devices
	Concurrent post, Naoya WATANABE	Research on process technology for three-dimensional integrated circuits
	Concurrent post, Takahiro MORI
	Concurrent post, Hidehiro ASAI
	Concurrent post, Kimihiko KATO	Silicon tunnel field-effect transistor ; Silicon quantum bit
	Concurrent post, Yuuki ARAGA	Analysis and measurement of electromagnetic interference among 3-D stacked ICs ; Development of method to stack superconductive chips using micro-bump or direct bonding
	Concurrent post, Hiroshi OKA	Semiconductor Device Technology for Quantum Computers ; Development of high-mobility Transitors
	Concurrent post, Shota IIZUKA	Development of Silicon quantum bit
	Concurrent post, Takumi INABA
	Concurrent post, Koh-ichi NITTOH