Adhesive bonding (structural adhesion) is a suitable technology for joining dissimilar materials such as carbon fiber composite materials (CFRP) and lightweight metal alloys, which have been increasingly used for weight reduction of automobiles and aircrafts. Fraunhofer IFAM and other research institutes that focus on adhesion technology exist worldwide, but there is no such institute in Japan. In this respect Japan significantly lags behind. In order to address the situation, we established Adhesion and Interfacial Phenomena Research Laboratory (AIRL) at AIST in 2015. Its mission is to strengthen Japan's international competitiveness and eventually establish a research center that will integrate a wide range of adhesion related research and development. We also established Consortium for Adhesion and Bonding Research (T-CAB) in 2016, with the goal of promoting collaboration between industry, academia and the government.
NEWS
- Mar. 22 2024
- Tour of Kyushu Center & 2nd Adhesion Lab Seminar
- Mar. 22 2024
- General Meeting (Special)
- Feb. 9, 2024
- General Meeting (Special)
- Feb. 8-9, 2024
- Mini-workshop of OHLF-AIST at OHLF＆VW tour
- Nov. 17, 2023
- 22nd Company Workshop
- Oct. 29, 2023
- 3rd Resource Circulation Working Group
- Aug. 29, 2023
- Tour of Central Plant East & 1st Adhesion Lab Seminar
- Aug. 2, 2023
- 2nd Resource Circulation Working Group
- June 27, 2023
- 1st Resource Circulation Working Group
- May 26, 2023
- General Meeting (Regular)
- Mar. 24, 2023
- General Meeting (Special)
- Mar. 22, 2023
- The 6th Adhesion and Bonding Research Symposiump
- Sept. 5, 2022
- 17th Company Workshop
- July 26, 2022
- 2nd Adhesion for battery and cell Working Group
- July 5, 2022
- 3rd Non-Destructive Testing Working Group
- June 7, 2022
- 16th Company Workshop
- May 26, 2022
- General Meeting (Regular)
- May 24, 2022
- 1st Adhesion for battery and cell Working Group
- Mar. 25, 2022
- General Meeting (Special)
- January 28 and
February 3, 2022 - 7th Electronics & 4th Data Driven Working Group
