接着技術の拠点整備を目指して

Adhesive bonding (structural adhesion) is a suitable technology for joining dissimilar materials such as carbon fiber composite materials (CFRP) and lightweight metal alloys, which have been increasingly used for weight reduction of automobiles and aircrafts. Fraunhofer IFAM and other research institutes that focus on adhesion technology exist worldwide, but there is no such institute in Japan. In this respect Japan significantly lags behind. In order to address the situation, we established Adhesion and Interfacial Phenomena Research Laboratory (AIRL) at AIST in 2015. Its mission is to strengthen Japan's international competitiveness and eventually establish a research center that will integrate a wide range of adhesion related research and development. We also established Consortium for Adhesion and Bonding Research (T-CAB) in 2016, with the goal of promoting collaboration between industry, academia and the government.

NEWS List to news

Mar. 22 2024
Tour of Kyushu Center & 2nd Adhesion Lab Seminar
Mar. 22 2024
General Meeting (Special)
Feb. 9, 2024
General Meeting (Special)
Feb. 8-9, 2024
Mini-workshop of OHLF-AIST at OHLF&VW tour
Nov. 17, 2023
22nd Company Workshop
Oct. 29, 2023
3rd Resource Circulation Working Group
Aug. 29, 2023
Tour of Central Plant East & 1st Adhesion Lab Seminar
Aug. 2, 2023
2nd Resource Circulation Working Group
June 27, 2023
1st Resource Circulation Working Group
May 26, 2023
General Meeting (Regular)
Mar. 24, 2023
General Meeting (Special)
Mar. 22, 2023
The 6th Adhesion and Bonding Research Symposiump
Sept. 5, 2022
17th Company Workshop
July 26, 2022
2nd Adhesion for battery and cell Working Group
July 5, 2022
3rd Non-Destructive Testing Working Group
June 7, 2022
16th Company Workshop
May 26, 2022
General Meeting (Regular)
May 24, 2022
1st Adhesion for battery and cell Working Group
Mar. 25, 2022
General Meeting (Special)
January 28 and
February 3, 2022
7th Electronics & 4th Data Driven Working Group

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AIST Tsukuba Central 5
1-1-1 Higashi, Tsukuba, Ibaraki
305-8565, Japan

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