History
- December 7, 2021
- 5th Symposium on Adhesion and Bonding Research
- November 6, 2020
- 4th Symposium on Adhesion and Bonding Research
- November 5, 2020
- 1st Standardization Working Group
- October 23, 2020
- 2nd Non-Destructive Testing Working Group
- October 15, 2020
- 3rd Electronics Working Group
- July 30, 2020
- 2nd Electronics Working Group
- July 14, 2020
- 8th Company Workshop
- July 3, 2020
- General Meeting (Regular)
- March 27, 2020
- General Meeting (Special)
- February 26, 2020
- Tour of Adhesion and Interfacial Phenomena Research Laboratory (AIRL) & 7th Company Workshop
- 01/15/2020
- 1st Electronics Working Group
- 12/02/2019
- 3rd Symposium on Adhesion and Bonding Research
- 11/08/2019
- 6th Company Workshop
- 09/10/2019
- 1st Non-Destructive Testing Working Group
- 08/30/2019
- Airbus Plant Site Tour
- 07/17/2019
- 5th Company Workshop
- 05/30/2019
- General Meeting
- 03/13/2019
- 4th Company Workshop
- 03/11/2019
- Laboratory tour of Adhesion and Interfacial Phenomena Research Laboratory (AIRL)
- 06/12/2018
- 2nd Symposium on Adhesion and Bonding Research
- 12/05-07/2018
- Exhibition booth at the 2nd Adhesion and Joining Expo (part of the 9th Highly-functional Material Week)
- 09/10/2018
- BMW Plant Site Tour
- 07/25/2018
- 3rd Company Workshop
- 05/14/2018
- 2nd Company Workshop
- 12/06/2018
- 2nd Symposium on Adhesion and Bonding Research held
- 12/05-07/2018
- Exhibition booth at the 2nd Adhesion and Joining Expo (part of the 9th Highly-functional Material Week) held
- 07/25/2018
- 3rd Company Workshop held
- 05/14/2018
- 2nd Company Workshop held
- 02/01/2018
- 1st Symposium on Adhesion and Bonding Research held
- 09/06/2017
- 1st Company Workshop held
- 05/26/2017
- Introduction of Technological Consortium for Adhesion and Bonding held
- 04/04–07/2017
- Exhibition booth at 1st Adhesion and Bonding EXPO held
- 02/15-17/2017
- Exhibition booth at nanotech 2017 held
- 01/20/2017
- 2nd Symposium on Structural Adhesion Research held
- 10/25/2016
- Workshop on Joint R&D in Adhesion Bondingwas held
- 10/01/2016
- Technological Consortium for Adhesion and Bonding founded
