Device
Deposition
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| Device name | Model | Specification | |
|---|---|---|---|
 |
Cluster-type Sputtering System | Ulvac SME-200J | |
 |
Nb-AI Josephson junction (JJ) fabrication system | Science plus M93-0012 | |
 |
Nb-AI Josephson junction (JJ) fabrication system | Seed Lab., Corporation M97-0014 | |
 |
TEOS-CVD | Samco PD-270STL-AI | |
 |
Oblique angle deposition system | PLASSYS | |
 |
Plasma-Enhanced Atomic Layer Deposition(PE-ALD) system | Samco AD-230LP | |
 |
Multi-target (HEX) sputtering system | EIKO ENGINEERING LTD. ES-350 | |
 |
Insulating film fabrication system | Seed Lab., Corporation M98-0021 |