研究紹介

3D Integration

3D Integration and Packaging: HDevelopment of key technologies for high-density 3D integration, leveraging seamless process integration across front-end, mid-end, and back-end.
System-Level Design and Evaluation: R&D on system-level design, simulation, and evaluation technologies to maximize the potential of 3D integration.
FPrototyping Hub for 3D Integration: Establishing a prototyping hub equipped with 3D integration and semiconductor tools, aiming for a full-stack development environment..

Advanced Packaging and Assembly Technologies: Hybrid packaging built upon MEMS prototyping. Key strengths: advanced silicon deep RIE, glass processing, heterogeneous wafer bonding.
3Comprehensive Backend Process Hub: Integration with the 3D Integrated System Development Hub. Advancing packaging technologies and fostering talent. Toward a central base for advanced packaging processes.

Next-Generation MRAM Development: High-speed, ultra-low-power, and reliable nonvolatile memory for cache, main memory, and storage-class applications. Examples include VC-MRAM, SOT-MRAM, and cross-point STT-MRAM.
300mm-Scale Quantum Process Platforms: Large-scale fabrication of superconducting circuits for quantum computing based at the Super Clean Room (SCR), AIST’s advanced 300mm process platform.
Fundamental Science and Materials for the Next Paradigm: Brain-inspired computing by spintronics memories and oscillators for information processing, Highly sensitive magnetic sensor, and First-principles investigation of new magnetic materials.