SiPC: MPW
banner
SiPC MPW
Activities of the consortium

- MPW shuttle/Dedicated prototyping
- Value chain technology development
Assembly, measurement, design … - Next generation technology development



Status of 2020 MPW service

- Devices
- Passive and Advanced Modulator
- Agency
- Sumitomo Corporation Kyushu Co.,Ltd.
- Design
- By users, PDK-based ⇒ Merged by the sales agency
- Wafer process
- AIST SCR
- Post process
- Sumitomo Corporation Kyushu Co.,Ltd.
- Schedule
- 2020/5
- Tape out
- 2020/6
- Wafer process lot in
- 2020/9
- Wafer process out
- 2020/10
- Dicint & sorting ⇒ shipping
- 2021/1
- Local cladding removal option


Device library list
Divice | parameter | Typical performance | status | reference |
---|---|---|---|---|
Channel waveguide(SIWG) | Prop. Loss (TE) | ~1.5 dB/cm | Confirmed | |
Rib waveguide, 110-nm half etch (RIB-110) | Prop. Loss (TE) | ~ 2 dB/cm | Confirmed | |
Modulator rib waveguide, 110-nm half etch (RIB-110) | Prop. Loss (TE) | ~ 20 dB/cm | Confirmed | Dopant for standard modulator implanted |
Edge fiber coupler (ECPL) | Insertion loss(TE/TM) | ~2 dB, ~2 dB | Confirmed | HNAF, MFD=4.1um |
1dB BW(TE/TM) | >50 nm, >50 nm | l=1550nm | ||
Surface grating fiber coupler, | Insertion loss(TE) | ~5 dB | Confirmed | SMF, l=1545nm |
110-nm half etch(GC-110) | 1dB BW(TE) | ~30 nm | Incident angle: 9° | |
SIWG-RIB transition | Transfer loss (TE) | < 0.1 dB | Confirmed | |
1x2 MMI coupler | Insertion loss | <4 dB | Confirmed | |
Branching error | <0.5 dB | |||
2x2 MMI coupler | Insertion loss | <4 dB | Confirmed | |
Branching error | <1 dB | |||
PIN injection MZI modulator | Phase shifter length | 500 um | Confirmed | Phase shifter length designable |
Insertion loss | -- | |||
VpL | ~0.01 V cm@~1V bias | |||
EO BW | ~230 MHz @~1V bias | |||
PN depletion MZI modulator | Phase shifter length | 2 mm | Confirmed | Phase shifter length designable |
Insertion loss | 5~6 dB | Standard GSG TWE | ||
VpL | 2.1~2.3 V cm | |||
EO BW | ~30 GHz@-2V bias | |||
TiN heater | TiN sheet registance | 26.5±0.1(1σ) Ω | Confirmed | |
TiN termination | DC resistance | ~50 Ω | Confirmed | Resistance designable |
S11@20GHz, 0V bias | ~-25 dB | For standard GSG TWE | ||
Waveguide bending | 180-degree bending loss (TE/TM) | 0.020/– dB (r=5mm) | Confirmed | |
0.015/0.047 dB (r=10 mm) | ||||
0.007/0.024 dB (r=20 mm) |
P-cell GDS available
footbody
Copyright © National Institute of Advanced Industrial Science and Technology (AIST)
(Japan Corporate Number 7010005005425). All rights reserved.