News & Information
Qufab foundry is now accepting applications for its 2nd run of FY2026.
Qufab is a cleanroom facility at AIST dedicated to the fabrication of superconducting devices. We are offering six runs each of the PHSTP and 1KP processes throughout FY2026.
For details on the application procedure, please visit here.
If you are interested in our fabrication services, please don’t hesitate to contact us.
Eligibility for FY2026
For research purposes only (Domestic and international organizations, public institutions, and private companies)Deadline (2nd run)
Deadline for application: Sun, May 31, 2026Deadline for design data: Tue., June 30, 2026 (PHSTP, 1KP)
Price
Please contact us for information on pricing.Specifications
| PHSTP Process |
4-Nb layers Nb/Al-AlOx/Nb Josephson junction layer Mo resistor layer Planarized SiO2 interlayer dielectric Minimum line width is 1.0 µm Minimum Josephson junction (JJ) is 1.0 µm square Critical current density of JJ (Jc) is 10 kA/cm2 Sheet resistance is 2.4 Ω Chip size: 7.1 x 7.1 mm  S. Nagasawa et al., IEICE Trans. Electron., vol. E104-C, no.9, pp. 435–445, Sep. 2021. |
|---|---|
| 1KP Process |
4-Nb layers Nb/Al-AlOx/Nb Josephson junction layer Pd resistor layer Planarized SiO2 interlayer dielectric Minimum line width is 1.0 µm Minimum Josephson junction (JJ) is 1.0 µm square Critical current density of JJ (Jc) is 1 kA/cm2 Sheet resistance is 1.2 Ω Chip size: 5.0 x 5.0 mm  T. Yamae et al., Sci. Rep., vol. 15, 41429, 2025.. |
Contact
M-Qufab-foundry-ml*aist.go.jp
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