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Outline of Super Clean Room Facility (SCR)

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SCR Outline

Super cleanroom

  • Floor area: 3,000 m2
  • Cleanliness: Class 3 (JIS B 9920, ISO 14644-1)
  • Wafer size: 12-inch wafer support
  • Based on CMOS technology utilizing ArF immersion lithography

Cleanroom environment

  • Temperature and humidity: 23±1°C 45±5% FFU (fine filter unit) with unidirectional flow
  • Chemical contamination control: 4-layer cross-section on one side, airlock, and chemical filter
  • Vibration control: Foundation improvement, mat slab, expansion joint, and concrete slab flooring in places


What can be done at the SCR

The super cleanroom (SCR) provides process equipment for the fabrication of general-purpose semiconductor integrated circuits using 300 mm silicon wafers. Research and development, as well as individual process modules and stand-alone processes can be performed utilizing the process menu shown below.

We also provide support for development of new techniques by offering advice on the use of pre-cleaning and contamination control.

*Processes currently available

  • Processes for passive Si-Photonics components (300 mm wafers)
  • Bulk & SOI 65 nm transistor processes (300 mm wafers)
  • 45 nm 2-layer copper wiring processes (300 mm wafers)



Research and Development Facilities Station, Platform Operation Unit, TIA Central Office, National Institute of Advanced Industrial Science and Technology (AIST)

Address: AIST Tsukuba West, 16-1 Onogawa, Tsukuba, Ibaraki 305-8569 Japan
Telephone: +81-29-849-1530  FAX: +81-29-849-1533

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