微細印刷エレクトロニクス
研究のねらい
様々な材料を高精細度・高精度にパターニングする技術はデバイスの小フットプリント化、高効率化、低コスト化に直結します。
我々は数μmレベルの微細パターンを高スループット・簡単に印刷形成する技術を開発しました。
様々な材料に展開し、電子デバイス、配線、光学素子、無機材料、エッチングレジストなど、微細加工・センサに関わる材料・プロセス基盤を提供します。
主な成果
インク膜と刷版間に生じる付着力を制御することにより、一桁マイクロメートルレベルの高精細パターンを簡便に形成できる「付着力コントラスト印刷」を開発しました。
刷版の1000回以上の連続耐久性確保や、10ppm以下の高い位置決め精度を誇る印刷装置の開発などにも成功しています。
各業界の企業様と連携して、これまで、受動部品、光学部品、フレキシブル温度センサ、印刷レジストなどの開発を行っております。
刷版の1000回以上の連続耐久性確保や、10ppm以下の高い位置決め精度を誇る印刷装置の開発などにも成功しています。
各業界の企業様と連携して、これまで、受動部品、光学部品、フレキシブル温度センサ、印刷レジストなどの開発を行っております。
機能性インクの開発
高精度印刷装置の開発
印刷酸化物トランジスタ
用途・展開先
高密度実装配線、各種センサ、機能性フィルム、電子部品の製造
成果リスト
(2023) Y. Kusaka, A. Hirata, A. Ohgata, N. Fukuda,
"Arc-to-sheet printer for high-precision patterning with positional errors below 6 ppm at 3σ level: Trochoidal trajectory mechanism for rotary motion of arc", Precision Engineering 83 192-203
(2022) Y. Kusaka, K. Kimnannara, M. Koutake, S. Kano, H. Furukawa, N. Fukuda,
"High-resolution patterning of silica nanoparticle-based ionogels by reverse-offset printing and its characterization", Flexible and Printed Electronics 7 035013
(2022) T. Kikkawa, D. Kumaki, S. Tokito, N. Fukuda, Y. Kusaka,
"Nickel oxide-based flexible thin-film NTC thermistors by using reverse offset printing", Flexible and Printed Electronics 7 015003
(2021) Y. Kusaka, T. Kawamura, M. Nakagawa, K. Okamoto, K. Tanaka, N. Fukuda,
"Fabrication of extremely conductive high-aspect silver traces buried in hot-embossed polycarbonate films via the direct gravure doctoring method", Advanced Powder Technology 32 764-770
(2020) Y. Kusaka, N. Fukuda, H. Ushijima,
"Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics", Japanese Journal of Applied Physics 59 SG0802
(2020) Y. Kusaka, N. Fukuda,
"Decomposition of pattern distortions by the Spread polynomial model in roll-to-sheet reverse offset printing", Journal of Micromechanics and Microengineering 30 095007
(2020) Y. Kusaka, A. Takei, M. Koutake, T. Fukasawa, T. Ishigami, N. Fukuda,
"Micro-transfer patterning of dense nanoparticle layers: roles of rheology, adhesion and fracture in transfer dynamics", Soft Matter 16 3276-3284
(2019) Y. Kusaka, M. Mizukami, T. Yamaguchi, N. Fukuda, H. Ushijima,
"Patterning defects in high-speed reverse offset printing: lessons from contact dynamics", Journal of Micromechanics and Microengineering 29 045001
(2019) Y. Kusaka, A. Takei, T. Fukasawa, T. Ishigami, N. Fukuda,
"Mechanisms of Adhesive Micropatterning of Functional Colloid Thin Layers", ACS Applied Materials & Interfaces 11 40602-40612
(2019) Y. Kusaka, M. Mizukami, T. Yamaguchi, N. Fukuda, H. Ushijima,
"Patterning defects in high-speed reverse offset printing: lessons from contact dynamics", Journal of Micromechanics and Microengineering 29 045001
(2019) Y. Kusaka, A. Takei, T. Fukasawa, T. Ishigami, N. Fukuda,
"Mechanisms of Adhesive Micropatterning of Functional Colloid Thin Layers", ACS Applied Materials & Interfaces 11 40602-40612
(2019) J. Leppäniemi, A. Sneck, Y. Kusaka, N. Fukuda, A. Alastalo,
"Reverse‐Offset Printing of Metal‐Nitrate‐Based Metal Oxide Semiconductor Ink for Flexible TFTs", Advanced Electronic Materials 5
(2018) Y. Kusaka, S. Kanazawa, H. Ushijima,
"Fully-printed vertical interconnections with tapered contact holes formed by vapor-annealing technique", 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) 306-307
(2018) Y. Kusaka, S. Kanazawa, H. Ushijima,
"Design rules for vertical interconnections by reverse offset printing", Journal of Micromechanics and Microengineering 28 035003
(2018) Y. Kusaka, N. Shirakawa, S. Ogura, J. Leppäniemi, A. Sneck, A. Alastalo, H. Ushijima, N. Fukuda,
"Reverse Offset Printing of Semidried Metal Acetylacetonate Layers and Its Application to a Solution-Processed IGZO TFT Fabrication", ACS Applied Materials & Interfaces 10 24339-24343
(2018) Y. Kusaka, A. Hirata, H. Ushijima,
"Direct adhesion contrast patterning on PDMS substrate by ArF excimer laser scanning for on-demand printing of functional layers", The International Journal of Advanced Manufacturing Technology 99 859-865
(2017) Y. Kusaka, S. Kanazawa, N. Yamamoto, H. Ushijima,
"Direct observation of microcontact behaviours in pattern-generation step of reverse offset printing", Journal of Micromechanics and Microengineering 27 015003
(2017) Y. Kusaka, S. Kanazawa, M. Koutake, H. Ushijima,
"Pattern size tolerance of reverse offset printing: a proximity deformation effect related to local PDMS slipping", Journal of Micromechanics and Microengineering 27 105018
(2017) Y. Kusaka, K. Sugihara, M. Koutake, H. Ushijima,
"Rewetting of semi-dried ink patterns by vapour annealing for developing a reflow process in reverse offset printing", Journal of Micromechanics and Microengineering 27 017002
(2016) Y. Kusaka, K. Sugihara, H. Ushijima,
"Push-pull process for contact defect-free patterning in reverse offset printing", Flexible and Printed Electronics 1 045004
(2015) Y. Kusaka, S. Ogura, H. Ushijima,
"Exploiting Hygroscopic Nature of IGZO Precursor Thin Films for Adhesive Tape Patterning", Colloids and Interface Science Communications 8 6-9
(2015) Y. Kusaka, M. Koutake, H. Ushijima,
"High-resolution patterning of silver conductive lines by adhesion contrast planography", Journal of Micromechanics and Microengineering 25 095002
(2015) Y. Kusaka, M. Koutake, H. Ushijima,
"Fabrication of embedded electrodes by reverse offset printing", Journal of Micromechanics and Microengineering 25 045017
"Arc-to-sheet printer for high-precision patterning with positional errors below 6 ppm at 3σ level: Trochoidal trajectory mechanism for rotary motion of arc", Precision Engineering 83 192-203
(2022) Y. Kusaka, K. Kimnannara, M. Koutake, S. Kano, H. Furukawa, N. Fukuda,
"High-resolution patterning of silica nanoparticle-based ionogels by reverse-offset printing and its characterization", Flexible and Printed Electronics 7 035013
(2022) T. Kikkawa, D. Kumaki, S. Tokito, N. Fukuda, Y. Kusaka,
"Nickel oxide-based flexible thin-film NTC thermistors by using reverse offset printing", Flexible and Printed Electronics 7 015003
(2021) Y. Kusaka, T. Kawamura, M. Nakagawa, K. Okamoto, K. Tanaka, N. Fukuda,
"Fabrication of extremely conductive high-aspect silver traces buried in hot-embossed polycarbonate films via the direct gravure doctoring method", Advanced Powder Technology 32 764-770
(2020) Y. Kusaka, N. Fukuda, H. Ushijima,
"Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics", Japanese Journal of Applied Physics 59 SG0802
(2020) Y. Kusaka, N. Fukuda,
"Decomposition of pattern distortions by the Spread polynomial model in roll-to-sheet reverse offset printing", Journal of Micromechanics and Microengineering 30 095007
(2020) Y. Kusaka, A. Takei, M. Koutake, T. Fukasawa, T. Ishigami, N. Fukuda,
"Micro-transfer patterning of dense nanoparticle layers: roles of rheology, adhesion and fracture in transfer dynamics", Soft Matter 16 3276-3284
(2019) Y. Kusaka, M. Mizukami, T. Yamaguchi, N. Fukuda, H. Ushijima,
"Patterning defects in high-speed reverse offset printing: lessons from contact dynamics", Journal of Micromechanics and Microengineering 29 045001
(2019) Y. Kusaka, A. Takei, T. Fukasawa, T. Ishigami, N. Fukuda,
"Mechanisms of Adhesive Micropatterning of Functional Colloid Thin Layers", ACS Applied Materials & Interfaces 11 40602-40612
(2019) Y. Kusaka, M. Mizukami, T. Yamaguchi, N. Fukuda, H. Ushijima,
"Patterning defects in high-speed reverse offset printing: lessons from contact dynamics", Journal of Micromechanics and Microengineering 29 045001
(2019) Y. Kusaka, A. Takei, T. Fukasawa, T. Ishigami, N. Fukuda,
"Mechanisms of Adhesive Micropatterning of Functional Colloid Thin Layers", ACS Applied Materials & Interfaces 11 40602-40612
(2019) J. Leppäniemi, A. Sneck, Y. Kusaka, N. Fukuda, A. Alastalo,
"Reverse‐Offset Printing of Metal‐Nitrate‐Based Metal Oxide Semiconductor Ink for Flexible TFTs", Advanced Electronic Materials 5
(2018) Y. Kusaka, S. Kanazawa, H. Ushijima,
"Fully-printed vertical interconnections with tapered contact holes formed by vapor-annealing technique", 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) 306-307
(2018) Y. Kusaka, S. Kanazawa, H. Ushijima,
"Design rules for vertical interconnections by reverse offset printing", Journal of Micromechanics and Microengineering 28 035003
(2018) Y. Kusaka, N. Shirakawa, S. Ogura, J. Leppäniemi, A. Sneck, A. Alastalo, H. Ushijima, N. Fukuda,
"Reverse Offset Printing of Semidried Metal Acetylacetonate Layers and Its Application to a Solution-Processed IGZO TFT Fabrication", ACS Applied Materials & Interfaces 10 24339-24343
(2018) Y. Kusaka, A. Hirata, H. Ushijima,
"Direct adhesion contrast patterning on PDMS substrate by ArF excimer laser scanning for on-demand printing of functional layers", The International Journal of Advanced Manufacturing Technology 99 859-865
(2017) Y. Kusaka, S. Kanazawa, N. Yamamoto, H. Ushijima,
"Direct observation of microcontact behaviours in pattern-generation step of reverse offset printing", Journal of Micromechanics and Microengineering 27 015003
(2017) Y. Kusaka, S. Kanazawa, M. Koutake, H. Ushijima,
"Pattern size tolerance of reverse offset printing: a proximity deformation effect related to local PDMS slipping", Journal of Micromechanics and Microengineering 27 105018
(2017) Y. Kusaka, K. Sugihara, M. Koutake, H. Ushijima,
"Rewetting of semi-dried ink patterns by vapour annealing for developing a reflow process in reverse offset printing", Journal of Micromechanics and Microengineering 27 017002
(2016) Y. Kusaka, K. Sugihara, H. Ushijima,
"Push-pull process for contact defect-free patterning in reverse offset printing", Flexible and Printed Electronics 1 045004
(2015) Y. Kusaka, S. Ogura, H. Ushijima,
"Exploiting Hygroscopic Nature of IGZO Precursor Thin Films for Adhesive Tape Patterning", Colloids and Interface Science Communications 8 6-9
(2015) Y. Kusaka, M. Koutake, H. Ushijima,
"High-resolution patterning of silver conductive lines by adhesion contrast planography", Journal of Micromechanics and Microengineering 25 095002
(2015) Y. Kusaka, M. Koutake, H. Ushijima,
"Fabrication of embedded electrodes by reverse offset printing", Journal of Micromechanics and Microengineering 25 045017