P302
Microfabrication of Fused Silica by Laser-induced Backside Wet Etching
Jun WANG,
Hiroyuki Niino,
Akira Yabe
NIMC
We developed a one-step technique to fabricate a well-defined micro-sized pattern
in fused silica, using laser-induced backside wet etching (LIBWE). One side of
the plate was in contact with organic solutions containing pyrene and the other side
was irradiated with the laser at room temperature. The etch rate ranged
from 5 to 25 nm/pulse with a KrF laser irradiation from 0.4 to 1.3 J/cm2, using an
acetone solution containing pyrene at a concentration of 0.4 mol/dm3. Threshold
fluence was 0.24 J/cm2, which is about one-fortieth lower than that with conventional
KrF-laser ablation. A SEM photograph of the lines pattern, whose width was 10 micrometer
and depth was 3.5 micrometer, had well-defined sharp edges without debris and cracks.
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