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Advanced Power Electronics Research Center

Large-scale Project Overview
These are the main large projects underway with outside cooperation at the Advanced Power Electronics Research Center.

Implementing Projects

1. Cross-ministerial Strategic Innovation Promotion Program (SIP) " Next-generation power electronics" (2014〜)
"Research and Development of Fundamental Technologies for SiC (Entrusted from NEDO)
/Development of the next generation SiC wafer
/Development of the next generation SiCdevice
/Development of the next generation SiCmodule
2.Cross-ministerial Strategic Innovation Promotion Program (SIP) " Next-generation power electronics" (2014〜)
"Research and Development of Fundamental Technologies for GaN Vertical Power Devices" (Entrusted from NEDO)
/Development of GaN Device Fabrication Process and Related Technologies (TCAD)
/Development of GaN Vertical Power Device and its Fabrication Process (Epitaxial Growth)
3.Cross-ministerial Strategic Innovation Promotion Program (SIP) " Next-generation power electronics" (2014〜)
"Fundamental Research and Development Project for Future Power Electronics" (Entrusted from NEDO)
/Development of Diamond Wafer for Diamond Power Electronic Device (Development of Wafer)
4. Tsukuba Power Electronics Constellations (TPEC)(Joint research with private enterprises)
Large-scale collaboration research consortium with private companies utilizing TIA-nano as a platform (2012〜)
/Establishment of R&D hub / R&D base at Tsukuba for power electronics
/Open innovation / Radical innovation for power electronics
/Reduction of R&D cost and risk by sharing
5.CREST  (Entrusted from JST)
"Creation of innovative technologies to control carbon dioxide emissions"
/Research for Ultra-Low Loss Power Devices
6.The Initiatives for Atomic Energy Basic and Generic Strategic Research
Research and development of diamond semiconductor devices for nuclear power electric plants operating in case of severe accident
/Development of diamond metal-semiconductor field effect transistor (MESFET) (2012-2015)

" Expired Projects "

◆ New Material Power Semiconductor Project for Achieving a Low-Carbon Society (Entrustedfrom METI in 2010 / NEDO in 2011-2014)
 / Technology for fabrication of high-quality SiC 6-inch wafers (bulk, processing, and epitaxial) and 3-5 kV class high-voltage SiC MOSFET technology
◆ Funding Program for World-Leading Innovative R&D on Science and Technology (JSPS subsidy project )

"Innovative Silicon Carbide (SiC) Power Electronics Research for Creating a Low-Carbon Society " (2009-2013)

10 kV class ultra-high-voltage-resistant SiC device technology (PiN diodes and IGBT) and SiC thick-film, multilayer epitaxial growth technology
◆ Green IT Project (Entrusted from NEDO)

"Next Generation Power Electronics Project" (2009-2012)

Server Power Supply, PV Power Conditioner, High-Temperature Modular Technology, Total Design for High Power Density










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